aboutsummaryrefslogtreecommitdiff
path: root/include/dt-bindings/interconnect
AgeCommit message (Collapse)AuthorFilesLines
2024-09-26Merge tag 'char-misc-6.12-rc1' of ↵Linus Torvalds3-10/+190
git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc Pull char / misc driver updates from Greg KH: "Here is the "big" set of char/misc and other driver subsystem changes for 6.12-rc1. Lots of changes in here, primarily dominated by the usual IIO driver updates and additions, but there are also small driver subsystem updates all over the place. Included in here are: - lots and lots of new IIO drivers and updates to existing ones - interconnect subsystem updates and new drivers - nvmem subsystem updates and new drivers - mhi driver updates - power supply subsystem updates - kobj_type const work for many different small subsystems - comedi driver fix - coresight subsystem and driver updates - fpga subsystem improvements - slimbus fixups - binder new feature addition for "frozen" notifications - lots and lots of other small driver updates and cleanups All of these have been in linux-next for a long time with no reported problems" * tag 'char-misc-6.12-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (354 commits) greybus: gb-beagleplay: Add firmware upload API arm64: dts: ti: k3-am625-beagleplay: Add bootloader-backdoor-gpios to cc1352p7 dt-bindings: net: ti,cc1352p7: Add bootloader-backdoor-gpios MAINTAINERS: Update path for U-Boot environment variables YAML nvmem: layouts: add U-Boot env layout comedi: ni_routing: tools: Check when the file could not be opened ocxl: Remove the unused declarations in headr file hpet: Fix the wrong format specifier uio: Constify struct kobj_type cxl: Constify struct kobj_type binder: modify the comment for binder_proc_unlock iio: adc: axp20x_adc: add support for AXP717 ADC dt-bindings: iio: adc: Add AXP717 compatible iio: adc: axp20x_adc: Add adc_en1 and adc_en2 to axp_data w1: ds2482: Drop explicit initialization of struct i2c_device_id::driver_data to 0 tools: iio: rm .*.cmd when make clean iio: adc: standardize on formatting for id match tables iio: proximity: aw96103: Add support for aw96103/aw96105 proximity sensor bus: mhi: host: pci_generic: Enable EDL trigger for Foxconn modems bus: mhi: host: pci_generic: Update EDL firmware path for Foxconn modems ...
2024-08-26Merge branch 'icc-sm8350' into icc-nextGeorgi Djakov1-10/+0
A set of fixes that target stability of the SM8350 platform. * icc-sm8350 interconnect: qcom: sm8350: drop DISP nodes dt-bindings: interconnect: qcom,sm8350: drop DISP nodes interconnect: qcom: sm8250: Enable sync_state Link: https://lore.kernel.org/r/[email protected]/ Signed-off-by: Georgi Djakov <[email protected]>
2024-08-23dt-bindings: interconnect: qcom,sm8350: drop DISP nodesDmitry Baryshkov1-10/+0
Vendor msm-5.x kernels declared duplicate indices for some of display nodes to be used by separate display RSC and BCM voters. As it is not clear how this separate BCM should be modelled upstream and the device trees do not use these indices, drop them for now. Signed-off-by: Dmitry Baryshkov <[email protected]> Acked-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2024-08-23dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoCAdam Skladowski1-0/+93
Add bindings for Qualcomm MSM8937 Network-On-Chip interconnect devices. Signed-off-by: Adam Skladowski <[email protected]> Reviewed-by: Rob Herring (Arm) <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2024-08-23dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoCAdam Skladowski1-0/+97
Add bindings for Qualcomm MSM8976 Network-On-Chip interconnect devices. Signed-off-by: Adam Skladowski <[email protected]> Reviewed-by: Rob Herring (Arm) <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2024-08-15dt-bindings: interconnect: Add Qualcomm IPQ5332 supportVaradarajan Narayanan1-0/+46
Add interconnect-cells to clock provider so that it can be used as icc provider. Add master/slave ids for Qualcomm IPQ5332 Network-On-Chip interfaces. This will be used by the gcc-ipq5332 driver for providing interconnect services using the icc-clk framework. Reviewed-by: Krzysztof Kozlowski <[email protected]> Signed-off-by: Varadarajan Narayanan <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Bjorn Andersson <[email protected]>
2024-07-19Merge tag 'char-misc-6.11-rc1' of ↵Linus Torvalds3-0/+160
git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc Pull char / misc and other driver updates from Greg KH: "Here is the "big" set of char/misc and other driver subsystem changes for 6.11-rc1. Nothing major in here, just loads of new drivers and updates. Included in here are: - IIO api updates and new drivers added - wait_interruptable_timeout() api cleanups for some drivers - MODULE_DESCRIPTION() additions for loads of drivers - parport out-of-bounds fix - interconnect driver updates and additions - mhi driver updates and additions - w1 driver fixes - binder speedups and fixes - eeprom driver updates - coresight driver updates - counter driver update - new misc driver additions - other minor api updates All of these, EXCEPT for the final Kconfig build fix for 32bit systems, have been in linux-next for a while with no reported issues. The Kconfig fixup went in 29 hours ago, so might have missed the latest linux-next, but was acked by everyone involved" * tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (330 commits) misc: Kconfig: exclude mrvl-cn10k-dpi compilation for 32-bit systems misc: delete Makefile.rej binder: fix hang of unregistered readers misc: Kconfig: add a new dependency for MARVELL_CN10K_DPI virtio: add missing MODULE_DESCRIPTION() macro agp: uninorth: add missing MODULE_DESCRIPTION() macro spmi: add missing MODULE_DESCRIPTION() macros dev/parport: fix the array out-of-bounds risk samples: configfs: add missing MODULE_DESCRIPTION() macro misc: mrvl-cn10k-dpi: add Octeon CN10K DPI administrative driver misc: keba: Fix missing AUXILIARY_BUS dependency slimbus: Fix struct and documentation alignment in stream.c MAINTAINERS: CC dri-devel list on Qualcomm FastRPC patches misc: fastrpc: use coherent pool for untranslated Compute Banks misc: fastrpc: support complete DMA pool access to the DSP misc: fastrpc: add missing MODULE_DESCRIPTION() macro misc: fastrpc: Add missing dev_err newlines misc: fastrpc: Use memdup_user() nvmem: core: Implement force_ro sysfs attribute nvmem: Use sysfs_emit() for type attribute ...
2024-07-06dt-bindings: interconnect: Add Qualcomm IPQ9574 supportVaradarajan Narayanan1-0/+59
Add interconnect-cells to clock provider so that it can be used as icc provider. Add master/slave ids for Qualcomm IPQ9574 Network-On-Chip interfaces. This will be used by the gcc-ipq9574 driver that will for providing interconnect services using the icc-clk framework. Acked-by: Georgi Djakov <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Signed-off-by: Varadarajan Narayanan <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Bjorn Andersson <[email protected]>
2024-07-04Merge branch 'icc-msm8953' into icc-nextGeorgi Djakov1-0/+93
Add interconnect driver for MSM8953-based devices. * icc-msm8953 dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC interconnect: qcom: Add MSM8953 driver Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2024-06-28dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoCVladimir Lypak1-0/+93
Add the device-tree bindings for interconnect providers used on MSM8953 platform. Signed-off-by: Vladimir Lypak <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Signed-off-by: Barnabás Czémán <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2024-06-13dt-bindings: interconnect: Add MediaTek EMI Interconnect bindingsAngeloGioacchino Del Regno2-0/+67
Add bindings for the MediaTek External Memory Interface Interconnect, which providers support system bandwidth requirements through Dynamic Voltage Frequency Scaling Resource Collector (DVFSRC) hardware. This adds bindings for MediaTek MT8183 and MT8195 SoCs. Note that this is modeled as a subnode of DVFSRC for multiple reasons: - Some SoCs have more than one interconnect on the DVFSRC (and two different kinds of EMI interconnect, and also a SMI interconnect); - Some boards will want to not enable the interconnect driver because some of those are not battery powered (so they just keep the knobs at full thrust from the bootloader and never care scaling busses); - Some DVFSRC interconnect features may depend on firmware. Reviewed-by: Rob Herring <[email protected]> Signed-off-by: AngeloGioacchino Del Regno <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2024-02-29Merge branch 'icc-sm7150' into icc-nextGeorgi Djakov1-0/+150
Add dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC. * icc-sm7150 dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings interconnect: qcom: Add SM7150 driver support Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2024-02-29dt-bindings: interconnect: Add Qualcomm SM7150 DT bindingsDanila Tikhonov1-0/+150
The Qualcomm SM7150 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Danila Tikhonov <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2024-02-26Merge branch 'icc-cleanup' into icc-nextGeorgi Djakov1-24/+0
* icc-cleanup interconnect: qcom: sm8550: Remove bogus per-RSC BCMs and nodes dt-bindings: interconnect: Remove bogus interconnect nodes interconnect: qcom: x1e80100: Remove bogus per-RSC BCMs and nodes interconnect: qcom: sa8775p: constify pointer to qcom_icc_node interconnect: qcom: sm8250: constify pointer to qcom_icc_node interconnect: qcom: sm6115: constify pointer to qcom_icc_node interconnect: qcom: sa8775p: constify pointer to qcom_icc_bcm interconnect: qcom: x1e80100: constify pointer to qcom_icc_bcm dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora address interconnect: constify of_phandle_args in xlate Signed-off-by: Georgi Djakov <[email protected]>
2024-01-31dt-bindings: interconnect: Remove bogus interconnect nodesKonrad Dybcio1-24/+0
The downstream kernel has infrastructure for passing votes from different interconnect nodes onto different RPMh RSCs. This neither implemented, not is going to be implemented upstream (in favor of a different solution using ICC tags through the same node). Unfortunately, as it happens, meaningless (in the upstream context) parts of the vendor driver were copied, ending up causing havoc - since all "per-RSC" (in quotes because they all point to the main APPS one) BCMs defined within the driver overwrite the value in RPMh on every aggregation. To both avoid keeping bogus code around and possibly introducing impossible-to-track-down bugs (busses shutting down for no reason), get rid of the duplicated ICC node definitions. Signed-off-by: Konrad Dybcio <[email protected]> Acked-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2024-01-31dt-bindings: interconnect: Add Qualcomm MSM8909 DT bindingsAdam Skladowski1-0/+93
Add bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices. [Stephan: Drop separate mm-snoc that exists downstream since it's actually the same NoC as SNoC in hardware] Signed-off-by: Adam Skladowski <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Signed-off-by: Stephan Gerhold <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-12-16Merge branch 'icc-sm6115' of ↵Bjorn Andersson1-0/+111
https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into HEAD Merge the SM6115 interconnect binding to allow referecing the interconnect header files and the ports defined in these.
2023-12-07Merge branch 'icc-x1e80100' of ↵Bjorn Andersson1-0/+207
https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into arm64-for-6.8 Merge the X1E80100 interconnect binding to get access to the interconnect port constants.
2023-12-06dt-bindings: interconnect: Add Qualcomm SM6115 NoCKonrad Dybcio1-0/+111
Add bindings for Qualcomm SM6115 Network-On-Chip interconnect. Signed-off-by: Konrad Dybcio <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-11-24dt-bindings: interconnect: Add Qualcomm X1E80100 SoCRajendra Nayak1-0/+207
The Qualcomm X1E80100 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Co-developed-by: Abel Vesa <[email protected]> Signed-off-by: Abel Vesa <[email protected]> Signed-off-by: Rajendra Nayak <[email protected]> Co-developed-by: Sibi Sankar <[email protected]> Signed-off-by: Sibi Sankar <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-11-24dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in ↵Neil Armstrong1-0/+154
Qualcomm SM8650 SoC Document the RPMh Network-On-Chip Interconnect of the SM8650 platform. Reviewed-by: Krzysztof Kozlowski <[email protected]> Signed-off-by: Neil Armstrong <[email protected]> Link: https://lore.kernel.org/r/20231123-topic-sm8650-upstream-interconnect-v2-1-7e050874f59b@linaro.org Signed-off-by: Georgi Djakov <[email protected]>
2023-10-10dt-bindings: interconnect: Add compatibles for SDX75Rohit Agarwal1-0/+102
Add dt-bindings compatibles and interconnect IDs for Qualcomm SDX75 platform. Signed-off-by: Rohit Agarwal <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-07-18Merge branch 'icc-sm8250-qup' into icc-nextGeorgi Djakov1-0/+7
SM8250 (like SM8150 but unlike all other QUP-equipped SoCs) doesn't provide a qup-core path. Adjust the bindings and drivers as necessary, and then describe the icc paths in the device tree. This makes it possible for interconnect sync_state succeed so long as you don't use UFS. * icc-sm8250-qup dt-bindings: interconnect: qcom,rpmh: Add SM8250 QUP virt dt-bindings: interconnect: qcom,sm8250: Add QUP virt interconnect: qcom: sm8250: Fix QUP0 nodes Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-07-16dt-bindings: interconnect: qcom,sm8250: Add QUP virtKonrad Dybcio1-0/+7
Add the required defines for QUP_virt nodes. Signed-off-by: Konrad Dybcio <[email protected]> Acked-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-07-15dt-bindings: interconnect: Add Qcom RPM ICC bindingsKonrad Dybcio1-0/+13
The SMD RPM interconnect driver requires different icc tags to the RPMh driver. Add bindings to reflect that. Acked-by: Krzysztof Kozlowski <[email protected]> Signed-off-by: Konrad Dybcio <[email protected]> Acked-by: Georgi Djakov <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Bjorn Andersson <[email protected]>
2023-05-18dt-bindings: interconnect/msm8996-cbf: add defines to be used by CBFDmitry Baryshkov1-0/+12
On msm8996 CBF interconnects power and performance CPU clusters. Add corresponding interconnect defines to be used in device trees. Acked-by: Krzysztof Kozlowski <[email protected]> Tested-by: Yassine Oudjana <[email protected]> Signed-off-by: Dmitry Baryshkov <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-02-06Merge branch 'icc-sa8775p' into icc-nextGeorgi Djakov1-0/+231
* icc-sa8775p dt-bindings: interconnect: qcom: document the interconnects for sa8775p interconnect: qcom: add a driver for sa8775p dt-bindings: interconnect: qcom,sa8775p-rpmh: fix a typo Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-02-06Merge branch 'icc-sdm670' into icc-nextGeorgi Djakov1-0/+136
* icc-sdm670 dt-bindings: interconnect: add sdm670 interconnects interconnect: qcom: add sdm670 interconnects Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-02-06Merge branch 'icc-ip0-migration' into icc-nextGeorgi Djakov6-16/+2
Commits 2f3724930eb4 ("interconnect: qcom: sc7180: Drop IP0 interconnects") and 2fb251c26560 ("interconnect: qcom: sdx55: Drop IP0 interconnects") removed IP0 interconnects (and ipa-virt devices support) in favour of the RPMH clocks. Follow this example for other platforms defining IP0 RPMH resource. While we are at it, remove several leftover from the mentioned patches. * icc-ip0-migration: interconnect: qcom: sdx55: drop IP0 remnants interconnect: qcom: sc7180: drop IP0 remnants interconnect: move ignore_list out of of_count_icc_providers() interconnect: qcom: sm8150: Drop IP0 interconnects interconnect: qcom: sm8250: Drop IP0 interconnects interconnect: qcom: sc8180x: Drop IP0 interconnects interconnect: qcom: sc8280xp: Drop IP0 interconnects dt-bindings: interconnect: qcom: Remove ipa-virt compatibles dt-bindings: interconnect: qcom: drop IPA_CORE related defines Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-01-19dt-bindings: interconnect: qcom: document the interconnects for sa8775pBartosz Golaszewski1-0/+231
Add a DT binding document for the RPMh interconnects on Qualcomm sa8775p platforms. Signed-off-by: Bartosz Golaszewski <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-01-19dt-bindings: interconnect: add sdm670 interconnectsRichard Acayan1-0/+136
There are controllable interconnects on Snapdragon 670. Add the compatible strings to the documentation and interconnect ID definitions. The device tree header was generated by linux-interconnect-driver-generator and the copyright year was changed. Signed-off-by: Richard Acayan <[email protected]> Acked-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-01-18dt-bindings: interconnect: qcom: drop IPA_CORE related definesDmitry Baryshkov6-16/+2
These interconnects are modeled as clks, not interconnects, therefore remove corresponding defines from the binding as they're unused. Acked-by: Krzysztof Kozlowski <[email protected]> Signed-off-by: Dmitry Baryshkov <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-01-05Merge branch 'icc-qdu1000' into icc-nextGeorgi Djakov1-0/+98
Add dt bindings and driver support for the Qualcomm QDU1000 and QRU1000 SoCs. The Qualcomm Technologies, Inc. Distributed Unit 1000 and Radio Unit 1000 are new SoCs meant for enabling Open RAN solutions. See more at https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/qualcomm_5g_ran_platforms_product_brief.pdf Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2023-01-05dt-bindings: interconnect: Add QDU1000/QRU1000 devicesMelody Olvera1-0/+98
Add separate schema for QDU1000 and QRU1000 interconnect devices to document the different NoCs on these platforms. Signed-off-by: Melody Olvera <[email protected]> Reviewed-by: Rob Herring <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2022-12-29dt-bindings: interconnect: Add Qualcomm SM8550Abel Vesa1-0/+189
The Qualcomm SM8550 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Abel Vesa <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2022-07-15Merge branch 'icc-imx8mp' into icc-nextGeorgi Djakov1-0/+59
This patchset is to support i.MX8MP NoC settings, i.MX8MP NoC initial value after power up is invalid, need set a valid value after related power domain up. This patchset also includes two patch[1,2] during my development to enable the ICC feature for i.MX8MP. I not include ddrc DVFS in this patchset, ths patchset is only to support NoC value mode/priority/ext_control being set to a valid value that suggested by i.MX Chip Design Team. The value is same as NXP downstream one inside Arm Trusted Firmware: https://source.codeaurora.org/external/imx/imx-atf/tree/plat/imx/imx8m/i/gpc.c?h=lf_v2.4#n97 Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2022-07-04dt-bindings: interconnect: add fsl,imx8mp.hPeng Fan1-0/+59
Add fsl,imx8mp.h for i.MX8MP Signed-off-by: Peng Fan <[email protected]> Acked-by: Rob Herring <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2022-06-20dt-bindings: interconnect: Add Qualcomm SM6350 NoC supportLuca Weiss1-0/+148
Add bindings for Qualcomm SM6350 Network-On-Chip interconnect devices. As SM6350 has two pairs of NoCs sharing the same reg, allow this in the binding documentation, as was done for qcm2290. Signed-off-by: Luca Weiss <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2022-05-18Merge branch 'icc-sc8180x' into icc-nextGeorgi Djakov1-0/+7
This contains a few fixes for the sc8180x interconnect provider driver to make it functional. * icc-sc8180x dt-bindings: interconnect: Add SC8180X QUP0 virt provider interconnect: qcom: sc8180x: Modernize sc8180x probe interconnect: qcom: sc8180x: Fix QUP0 nodes interconnect: qcom: sc8180x: Mark some BCMs keepalive Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2022-05-18interconnect: qcom: sc8180x: Fix QUP0 nodesBjorn Andersson1-0/+7
The QUP0 BCM relates to some internal property of the QUPs, and should be configured independently of the path to the QUP. In line with other platforms expose QUP_CORE endpoints in order allow this configuration. Signed-off-by: Bjorn Andersson <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2022-05-18Merge branch 'icc-sdx65' into icc-nextGeorgi Djakov1-0/+67
This adds interconnect driver support for SDX65 platform for scaling the bandwidth requirements over RPMh. Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2022-04-26dt-bindings: interconnect: Add Qualcomm SDX65 DT bindingsRohit Agarwal1-0/+67
Add interconnect IDs for Qualcomm SDX65 platform. Signed-off-by: Rohit Agarwal <[email protected]> Reviewed-by: Krzysztof Kozlowski <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2022-04-22dt-bindings: interconnect: qcom: Add sc8280xp bindingBjorn Andersson1-0/+232
The Qualcomm SC8280XP platform has the usual set of busses, add a binding for these interconnect providers and port definitions to allow interconnect paths to be expressed in the sc8280xp DeviceTree. Reviewed-by: Krzysztof Kozlowski <[email protected]> Signed-off-by: Bjorn Andersson <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2021-12-15Merge branch 'icc-qcm2290' into icc-nextGeorgi Djakov1-0/+94
Add support for QCM2290 including a few prep changes. * icc-qcm2290 interconnect: icc-rpm: Define ICC device type interconnect: icc-rpm: Add QNOC type QoS support interconnect: icc-rpm: Support child NoC device probe dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support interconnect: qcom: Add QCM2290 driver support Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2021-12-15dt-bindings: interconnect: Add Qualcomm QCM2290 NoC supportShawn Guo1-0/+94
Add bindings for Qualcomm QCM2290 Network-On-Chip interconnect devices. Signed-off-by: Shawn Guo <[email protected]> Reviewed-by: Rob Herring <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2021-12-14Merge branch 'icc-sm8450' into icc-nextGeorgi Djakov1-0/+171
This add device tree binding and driver for interconnect providers found in SM8450 SoC. * icc-sm8450 dt-bindings: interconnect: Add Qualcomm SM8450 DT bindings interconnect: qcom: Add SM8450 interconnect provider driver Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2021-12-14dt-bindings: interconnect: Add Qualcomm SM8450 DT bindingsVinod Koul1-0/+171
The Qualcomm SM8450 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand Signed-off-by: Vinod Koul <[email protected]> Acked-by: Rob Herring <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2021-11-22dt-bindings: interconnect: Add Qualcomm MSM8996 DT bindingsYassine Oudjana1-0/+163
Add bindings for interconnects on Qualcomm MSM8996. Signed-off-by: Yassine Oudjana <[email protected]> Reviewed-by: Rob Herring <[email protected]> Reviewed-by: Dmitry Baryshkov <[email protected]> Tested-by: Dmitry Baryshkov <[email protected]> #db820c Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2021-08-09dt-bindings: interconnect: Add Qualcomm SC8180x DT bindingsGeorgi Djakov1-0/+185
Add compatibles and port definitions for the SC8180x RPMH interconnect providers. Signed-off-by: Georgi Djakov <[email protected]> [bjorn: Split defines from driver patch and added binding update] Signed-off-by: Bjorn Andersson <[email protected]> Reviewed-by: Rob Herring <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
2021-05-11dt-bindings: interconnect: Add Qualcomm SC7280 DT bindingsOdelu Kukatla1-0/+165
The Qualcomm SC7280 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Odelu Kukatla <[email protected]> Reviewed-by: Rob Herring <[email protected]> Link: https://lore.kernel.org/r/[email protected] Signed-off-by: Georgi Djakov <[email protected]>
Powered by cgit, Gruvboxed by Blaster4385.