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authorMichael Chan <[email protected]>2019-07-29 06:10:19 -0400
committerDavid S. Miller <[email protected]>2019-07-29 14:19:08 -0700
commit218a8a71d91ab9e52205f4098cf1fe121c98850e (patch)
treec5b2beb982b4c5048f7b683034c562dbe8d8ad0b /tools/perf/scripts/python/failed-syscalls-by-pid.py
parent2792b5b95ed5f38279da08f467a490687332324d (diff)
bnxt_en: Add TPA structure definitions for BCM57500 chips.
The new chips have a slightly modified TPA interface for LRO/GRO_HW. Modify the TPA structures so that the same structures can also be used on the new chips. Signed-off-by: Michael Chan <[email protected]> Signed-off-by: David S. Miller <[email protected]>
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