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authorKunihiko Hayashi <hayashi.kunihiko@socionext.com>2022-12-13 17:24:48 +0900
committerRob Herring <robh@kernel.org>2022-12-26 16:09:29 -0600
commit5993f6bd555e2696bb4d79cf54b976cb58793534 (patch)
treedbdc529af32fc7f985bc3e9b28eb082432ffa71d /scripts/gdb/linux/modules.py
parent0c00d8d315f09ef8639369a7f12e270b7a86bf79 (diff)
dt-bindings: soc: socionext: Add UniPhier DWC3 USB glue layer
Add DT binding schema for components belonging to the platform-specific DWC3 USB glue layer implemented in UniPhier SoCs. This USB glue layer works as a sideband logic for the host controller, including core reset, vbus control, PHYs, and some signals to the controller. Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221213082449.2721-17-hayashi.kunihiko@socionext.com Signed-off-by: Rob Herring <robh@kernel.org>
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