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authorHuang Ying <[email protected]>2017-09-06 16:22:30 -0700
committerLinus Torvalds <[email protected]>2017-09-06 17:27:28 -0700
commit225311a46411c37e20e73d99f4382f141e12f6f9 (patch)
tree07073d6ba4af58e79fb91cbc7dfb9b985852005e /lib/mpi/mpi-cmp.c
parent98cc093cba1e925eb34963dedb5f1684f1bdb2f4 (diff)
mm: test code to write THP to swap device as a whole
To support delay splitting THP (Transparent Huge Page) after swapped out, we need to enhance swap writing code to support to write a THP as a whole. This will improve swap write IO performance. As Ming Lei <[email protected]> pointed out, this should be based on multipage bvec support, which hasn't been merged yet. So this patch is only for testing the functionality of the other patches in the series. And will be reimplemented after multipage bvec support is merged. Link: http://lkml.kernel.org/r/[email protected] Signed-off-by: "Huang, Ying" <[email protected]> Cc: "Kirill A . Shutemov" <[email protected]> Cc: Andrea Arcangeli <[email protected]> Cc: Dan Williams <[email protected]> Cc: Hugh Dickins <[email protected]> Cc: Jens Axboe <[email protected]> Cc: Johannes Weiner <[email protected]> Cc: Michal Hocko <[email protected]> Cc: Minchan Kim <[email protected]> Cc: Rik van Riel <[email protected]> Cc: Ross Zwisler <[email protected]> [for brd.c, zram_drv.c, pmem.c] Cc: Shaohua Li <[email protected]> Cc: Vishal L Verma <[email protected]> Signed-off-by: Andrew Morton <[email protected]> Signed-off-by: Linus Torvalds <[email protected]>
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