diff options
author | Tony Lindgren <[email protected]> | 2014-12-01 11:10:15 -0800 |
---|---|---|
committer | Felipe Balbi <[email protected]> | 2014-12-22 10:26:06 -0600 |
commit | c0442479652b99b62dd1ffccb34231caff25751c (patch) | |
tree | e4a8a19a52e698d8ee87322f43cf7e8561db1573 /tools/perf/scripts/python/export-to-postgresql.py | |
parent | 4fde6204df052bb89ba3d915ed6ed9f306f3cfa1 (diff) |
usb: musb: Fix randconfig build issues for Kconfig options
Commit 82c02f58ba3a ("usb: musb: Allow multiple glue layers to be
built in") enabled selecting multiple glue layers, which in turn
exposed things more for randconfig builds. If NOP_USB_XCEIV is
built-in and TUSB6010 is a loadable module, we will get:
drivers/built-in.o: In function `tusb_remove':
tusb6010.c:(.text+0x16a817): undefined reference to `usb_phy_generic_unregister'
drivers/built-in.o: In function `tusb_probe':
tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register'
make: *** [vmlinux] Error 1
Let's fix this the same way as commit 70c1ff4b3c86 ("usb: musb:
tusb-dma can't be built-in if tusb is not").
And while at it, let's not allow selecting the glue layers except
on platforms really using them unless COMPILE_TEST is specified:
- TUSB6010 is in practise only used on omaps
- DSPS is only used on TI platforms
- UX500 is only used on STE platforms
Cc: Linus Walleij <[email protected]>
Reported-by: Jim Davis <[email protected]>
Signed-off-by: Tony Lindgren <[email protected]>
Signed-off-by: Felipe Balbi <[email protected]>
Diffstat (limited to 'tools/perf/scripts/python/export-to-postgresql.py')
0 files changed, 0 insertions, 0 deletions